E-401/2S - Compact fully automatic, vacuum load locked, cassette to cassette, sputtering system for R&D to medium scale production applications.

Equipped with, up to, four 100 mm diameter magnetron sputtering electrodes and off-set sample rotation good within sample non-uniformity maybe achieved across a 150 mm diameter area. Larger areas can be coated with reduced levels of uniformity.

Standard features also include variable source to substrate separation (100 mm range) RF bias sputter etching capability and substrate heating to 300° C.

These systems with one or two process modules are well suited to various applications including the production of MEMS, LEDs and Laser Diodes.

Alternative configurations allow the substitution of a single large (315 mm diameter, full erosion area) magnetron cathode, in place of multiple small electrodes and arrangements to achieve high-aspect-ratio directional sputtering.