E-400S - Compact fully automatic, vacuum load locked sputtering system for R&D to medium scale production applications.

Equipped with, up to, four 100 mm diameter magnetron sputtering electrodes and off-set sample rotation good within sample non-uniformity maybe achieved across a 150 mm diameter area. Larger areas can be coated with reduced levels of uniformity.

Standard features also include variable source to substrate separation (100 mm range) RF bias sputter etching capability and substrate heating to 300ºC. These capable systems provide a good platform for process development and migration to production for emerging nano device technologies.